R8A774A0HA01BG#G2 Renesas Electronics Corporation
Виробник: Renesas Electronics Corporation
Description: IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
Packaging: Tray
Package / Case: 1022-BGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 1.5GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57
Voltage - I/O: 0.82V, 1.8V, 3.3V
Supplier Device Package: 1022-FPBGA (29x29)
Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
USB: USB (2)
Number of Cores/Bus Width: 6 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: DU
Additional Interfaces: CAN, I2C, SCI, SPI
Description: IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA
Packaging: Tray
Package / Case: 1022-BGA
Mounting Type: Surface Mount
Speed: 1.2GHz, 1.5GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57
Voltage - I/O: 0.82V, 1.8V, 3.3V
Supplier Device Package: 1022-FPBGA (29x29)
Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
USB: USB (2)
Number of Cores/Bus Width: 6 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: DU
Additional Interfaces: CAN, I2C, SCI, SPI
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Технічний опис R8A774A0HA01BG#G2 Renesas Electronics Corporation
Description: IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA, Packaging: Tray, Package / Case: 1022-BGA, Mounting Type: Surface Mount, Speed: 1.2GHz, 1.5GHz, Operating Temperature: -40°C ~ 85°C (TA), Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57, Voltage - I/O: 0.82V, 1.8V, 3.3V, Supplier Device Package: 1022-FPBGA (29x29), Ethernet: 10/100Mbps (1), 100/1000Mbps (1), USB: USB (2), Number of Cores/Bus Width: 6 Core, 64-Bit, RAM Controllers: LPDDR4, Graphics Acceleration: No, Display & Interface Controllers: DU, Additional Interfaces: CAN, I2C, SCI, SPI.